Microtechnology/Additive Processes
Additive Processes edit
Processes where material is added to the wafer.
Overview edit
Oxidation edit
Oxidation in microtechnology refers most often to the oxidation of silicon. A layer of silicon dioxide created on the surface of a silicon wafer can be easily patterned. An SiO2 layer can be created by thermal oxidation or by deposition.
Chemical Vapor Deposition (CVD) edit
Physical Vapor Deposition (PVD) edit
Sputter Deposition edit
Electron Beam Evaporation Coating edit
Epitaxial Growth edit
- Metal Organic Vapor Phase Epitaxy (MOVPE)
- Molecular beam epitaxy (MBE) using solid sources and Chemical beam epitaxy (CBE) using gasseuos sources.
- Epitaxy in general.
- Atomic layer epitaxy where only a few monolayers are deposited and bond to chemisorption sites on the surface.
Electrochemical Methods edit
Electroplating edit
- Electroplating
- list of standard reaction potentials standard reduction potentials
Electroless depositions edit
- Electroless nickel plating
- Electrochemical deposition of metals onto silicon
- Y. Okinaka, in Electroless Plating: Fundamentals and Applications, edited by Glenn O. Mallory and Juan B. Hajdu, Chapter 15, American Electroplaters and Surface Finishers Society (1990).
Spinning edit
Photo and electron beam resists as well as many other polymers are often coated on wafers by spinning a volatile solution of the compound onto the wafer.
Surface Functionalization edit
- Self-assembled monolayers (SAM)
- Hydrophobe and Hydrophile surface layers to control wetting.
References edit
See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.