Microtechnology/Additional Methods

Additional MethodsEdit

Apart from additiev and etching processes, there is also a range of processes to alter the materials properties and to characterize them.

Rapid Thermal Anneal (RTA)Edit

Wafer BondingEdit

Wafer bonding

Wafer bond characterization

Electrical ConnectionsEdit

DopingEdit

Ion ImplantationEdit

Diffusion DopingEdit

Spin-on dopingEdit

PackagingEdit

InterconnectionsEdit

EncapsulationEdit

  • Silicone oil
  • Spray-on polymers
GluesEdit
  • Epo-tek H77 is a common packaging two-component UHV compatible epoxy glue.
  • Fortafix makes a high temperature glue that should work up to around 1000 C called Rocksett.
  • Vitcas Refractories manufacturer of high temperature glue/adhesives for industrial and domestic use up to 1700 C

EllipsometryEdit

Ellipsometers are used to measure thin film thicknesses by their optical properties (refractive index and reflectivity/absorbance).

4 Point MeasurementsEdit

The four-point probe technique can be used to measure the conductivity of thin films. For improved measurements micro four-point probes can be used. Capres has an application note about micro four-point probes.

Atomic Force MicroscopyEdit

The Atomic force microscope (AFM) is mainly used to measure the topography of a surface, such as the roughness.

Scanning Electron MicroscopyEdit

JEOL has a good guide to SEM image interpretation

Optical MicroscopyEdit

Theres a good introduction to optical microscopy from Zeiss.

Vacuum EquipmentEdit

ReferencesEdit

See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.