Microtechnology/Additional Methods

Additional MethodsEdit

Apart from additiev and etching processes, there is also a range of processes to alter the materials properties and to characterize them.

Rapid Thermal Anneal (RTA)Edit

Wafer BondingEdit

Wafer bonding

Wafer bond characterization

Electrical ConnectionsEdit


Ion ImplantationEdit

Diffusion DopingEdit

Spin-on dopingEdit




  • Silicone oil
  • Spray-on polymers
  • Epo-tek H77 is a common packaging two-component UHV compatible epoxy glue.
  • Fortafix makes a high temperature glue that should work up to around 1000 C called Rocksett.
  • Vitcas Refractories manufacturer of high temperature glue/adhesives for industrial and domestic use up to 1700 C


Ellipsometers are used to measure thin film thicknesses by their optical properties (refractive index and reflectivity/absorbance).

4 Point MeasurementsEdit

The four-point probe technique can be used to measure the conductivity of thin films. For improved measurements micro four-point probes can be used. Capres has an application note about micro four-point probes.

Atomic Force MicroscopyEdit

The Atomic force microscope (AFM) is mainly used to measure the topography of a surface, such as the roughness.

Scanning Electron MicroscopyEdit

JEOL has a good guide to SEM image interpretation

Optical MicroscopyEdit

Theres a good introduction to optical microscopy from Zeiss.

Vacuum EquipmentEdit


See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.