File:Nintendo-Wii-U-processor-heatspreader.jpg

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Summary

Description	English: An illustration of the Wii U MCM with heat spreader. The markings indicate that it's designed by Nintendo, and its components are made by AMD, IBM and Renesas. It also says that it was assembled in the 26th week of 2012. Inspiration from images provided by Nintendo [1], iFixit [2] and AnandTech [3]
Date	30 November 2012, 12:28:08
Source	Own work
Author	Henriok

I, the copyright holder of this work, hereby publish it under the following license:

	This file is made available under the Creative Commons CC0 1.0 Universal Public Domain Dedication.
	The person who associated a work with this deed has dedicated the work to the public domain by waiving all of their rights to the work worldwide under copyright law, including all related and neighboring rights, to the extent allowed by law. You can copy, modify, distribute and perform the work, even for commercial purposes, all without asking permission. CC0falsefalse

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	Date/Time	Thumbnail	Dimensions	User	Comment
current	11:41, 30 November 2012		1,488 × 1,488 (356 KB)	Henriok	User created page with UploadWizard

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