Microtechnology/Additional Methods

Additional Methods

Apart from additiev and etching processes, there is also a range of processes to alter the materials properties and to characterize them.

Rapid Thermal Anneal (RTA)

• Rapid thermal anneal (RTA)

Wafer Bonding

Wafer bonding

• Direct bonding
• Plasma activated bonding
• Anodic bonding
• Eutectic bonding
• Glass frit bonding
• Adhesive bonding
• Thermocompression bonding
• Reactive bonding

Wafer bond characterization

Doping

• Dopant

Ion Implantation

• Ion Implantation

Packaging

Interconnections

• Wire bonding
• Flip chip bonding
• Wedge bonding
• Using ZIF sockets

Encapsulation

• Silicone oil
• Spray-on polymers

Glues

• Epo-tek H77 is a common packaging two-component UHV compatible epoxy glue.
• Fortafix makes a high temperature glue that should work up to around 1000 C called Rocksett.
• Vitcas Refractories manufacturer of high temperature glue/adhesives for industrial and domestic use up to 1700 C

Ellipsometry

Ellipsometers are used to measure thin film thicknesses by their optical properties (refractive index and reflectivity/absorbance).

4 Point Measurements

The four-point probe technique can be used to measure the conductivity of thin films. For improved measurements micro four-point probes can be used. Capres has an application note about micro four-point probes.

Atomic Force Microscopy

The Atomic force microscope (AFM) is mainly used to measure the topography of a surface, such as the roughness.

Scanning Electron Microscopy

JEOL has a good guide to SEM image interpretation

Optical Microscopy

Theres a good introduction to optical microscopy from Zeiss.

Vacuum Equipment

• mass flow controllers (MFC) Gas conversion factors and formulas for calculating them

References

See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.